Northrop Grumman has been selected as one of the companies eligible for task orders totaling up to $25 billion under the US Defense Microelectronics Activity’s Advanced Technology Support Program V (ATSP V).
ATSP V is designed to accelerate the integration of domestically produced microelectronics into US military platforms.
Through the program, Northrop Grumman can respond to government requests for proposals within 30 days, with the company targeting a proposal-to-award timeline of roughly 80 to 90 days.
Structured as an indefinite-delivery, indefinite-quantity contract, ATSP V enables the Department of Defense and other federal agencies to rapidly access advanced engineering solutions, spanning next-generation semiconductor manufacturing, advanced packaging, and emerging materials technologies.
Northrop Grumman is joined by nine other firms under the program, including Battelle Memorial Institute, DRS Network & Imaging Systems, General Dynamics Mission Systems, HII Mission Technologies, L3Harris Technologies, Leidos, Raytheon, Charles Stark Draper Laboratory, and Vertex Aerospace.
The award is part of a broader US push to strengthen domestic microelectronics capabilities for defense applications.
Notable earlier efforts include a $3.13-billion, decade-long contract awarded to GlobalFoundries in September 2023, as well as a $576-million DMEA contract secured by IBM in 2024 to support trusted semiconductor manufacturing for national security systems.
