HII has announced its selection, alongside 11 other companies, for the Advanced Technology Support Program V (ATSP5), a 10-year multiple-award contract valued at $25.4 billion that delivers engineering solutions for complex electronics and software challenges.
Administered by the US Defense Microelectronics Activity, ATSP5 supports the US Department of Defense and other federal agencies by providing access to advanced microelectronics, engineering services, prototyping, and technology modernization capabilities.
The program is designed to mitigate system obsolescence, accelerate fielding timelines, and enable the adoption of emerging technologies to address evolving operational threats.
ATSP5 emphasizes solutions that sustain existing systems, enhance mission capabilities, and rapidly respond to new requirements.
Under the contract, HII engineers contribute system- and component-level expertise, including reverse engineering, microelectronics assurance, and the re-fielding of legacy systems that have become obsolete, leveraging proprietary tools and a model-based engineering approach.
The program streamlines acquisition by simplifying procurement processes and offering government customers rapid access to a pool of pre-qualified industry partners, including leading defense contractors.
Its scope spans both hardware and software, covering activities such as analysis, design, software development, simulation, integration, testing, producibility evaluations, and limited extended production.
ATSP5 also enables modular acquisition of major systems, allowing capabilities to be delivered in phases while integrating ongoing technological advancements. Program execution is overseen through monthly Program Management Reviews with DMEA leadership, focusing on cost, schedule, and performance metrics.
